元器件交易网讯 4月10日消息，据台湾电子时报报道，来自业内的消息称，索尼移动通信已在Xperia Z2中采用了超薄热导管，台湾热模块厂商期望其他智能手机厂商能够效仿。

　　日本厂商NEC在2013年已主动在4.7英寸Media X06E上采用热导管。从那以后，三星电子和联想已联手台湾热模块厂商合作开发专用于智能手机的超薄热导管。不过，三星和联想还没有在智能手机中采用类似的散热组件。

　　日本古河电工和Fujikura，台湾的超众科技、泰硕电子、双鸿科技、Asia Vital元器件和Yeh-Chiang科技都在开发用于智能手机的超薄导热管。

　　用于个人电脑的导热管直径为1-2mm，用于超极本和平板电脑的导热管直径分别为1-1.2mm和0.8mm。用于智能手机的0.6mm导热管已经开发出并将量产。这种导热管要优于当前主流的智能手机散热材料——石墨碳纤维。（元器件交易网刘光明 译）

　　外媒原文如下：

　　Taiwan makers look to demand for thin heat-pipes used in smartphones  

　　Sony Mobile Communications has adopted thin heat-pipes for its Xperia Z2, and Taiwan-based thermal module makers hope that other smartphone vendors will follow suit, according to Taiwan-based supply chain makers.

　　Japan-based vendor NEC took the initiative to use heat-pipes in its 4.7-inch Media X06E in 2013, and since then Samsung Electronics and Lenovo have cooperated with Taiwan-based thermal module makers to develop thin heat pipes specifically for use in smartphones, the sources indicated. However, Samsung and Lenovo have not yet decided to adopt such heat-dissipation components for smartphones, the sources pointed out.

　　Japan-based Furukawa Electric and Fujikura as well as Taiwan-based Chaun Choung Technology, TaiSol Electronics, Auras Technology, Asia Vital Components and Yeh-Chiang Technology have developed thin heat-pipes for use in smartphones, the sources noted.

　　While heat-pipes used in PCs range from 1mm to 2mm in diameter, models for use in ultrabooks and tablets have smaller diameters of 1-1.2mm and 0.8mm respectively. Models specifically for smartphones with a diameter of 0.6mm have been developed and are ready for volume production, with heat-dissipation effects better than those for graphite carbon fiber which is currently the mainstream heat-dissipation material for smartphones, the sources indicated.