元器件交易网讯 4月2日消息，据外媒报道，日月光半导体公司（ASE）计划与华亚科技联合成立合资公司，该公司主要对器件使用3D封装TSV（高密度的硅穿孔）技术。

　　ASE和华亚科已经谈判有一年多，并预计很快进入进程，该合资企业很可能被设置在华亚科技的闲置厂房或日月光工厂中。两家公司最初的生产目标是每月推出1万片3D IC芯片，预计将扩大TSV封装范围，包括应用处理器和移动RAM芯片。（元器件交易网   白玉涛译）

　　以下为外文：

　　在ASE-华亚科合资公司也有可能与台湾半导体制造公司（TSMC）在3D IC封装业竞争，该消息人士指出。Advanced Semiconductor Engineering (ASE) reportedly plans to team up with Inotera Memories to set up a joint venture for handling TSV (through-silicon via) 3D IC packaging.

　　ASE and Inotera have been in talks for over a year and are expected to finalize the deal soon, said the sources, adding that the joint venture is likely to be set up either at a Inotera's idle plant or at a ASE plant in Chungli, north Taiwan.

　　Initial production aims are to roll out 10,000 3D IC chips a month, said the sources, adding that the two firms are expected to expand the TSV packaging technology to include application processors and mobile RAM chips.

　　The ASE-Inotera joint venture is also likely to compete with Taiwan Semiconductor Manufacturing Company (TSMC) in the 3D IC packaging sector, the sources noted.